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Power chips are connected to outside circuits through packaging, and their efficiency depends upon the support of the product packaging. In high-power scenarios, power chips are generally packaged as power modules. Chip interconnection refers to the electric link on the upper surface area of the chip, which is generally aluminum bonding cable in typical modules. ^
Traditional power module bundle cross-section

Presently, commercial silicon carbide power modules still mainly use the packaging innovation of this wire-bonded standard silicon IGBT module. They deal with issues such as large high-frequency parasitic parameters, insufficient warm dissipation ability, low-temperature resistance, and not enough insulation strength, which limit making use of silicon carbide semiconductors. The display screen of excellent efficiency. In order to fix these troubles and fully manipulate the substantial possible benefits of silicon carbide chips, many brand-new packaging innovations and options for silicon carbide power modules have arised over the last few years.

Silicon carbide power module bonding approach


(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have actually created from gold cable bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually created from gold wires to copper cables, and the driving force is cost decrease; high-power tools have actually created from light weight aluminum cords (strips) to Cu Clips, and the driving pressure is to improve product performance. The higher the power, the greater the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a solid copper bridge soldered to solder to attach chips and pins. Compared with typical bonding packaging approaches, Cu Clip modern technology has the complying with benefits:

1. The connection in between the chip and the pins is constructed from copper sheets, which, to a particular level, changes the basic cord bonding approach between the chip and the pins. Therefore, an unique package resistance value, higher present flow, and much better thermal conductivity can be acquired.

2. The lead pin welding area does not need to be silver-plated, which can fully save the cost of silver plating and inadequate silver plating.

3. The product appearance is totally regular with regular items and is mostly used in servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power supplies, and various other fields.

Cu Clip has 2 bonding methods.

All copper sheet bonding approach

Both eviction pad and the Source pad are clip-based. This bonding technique is much more pricey and complicated, yet it can achieve far better Rdson and better thermal impacts.


( copper strip)

Copper sheet plus wire bonding technique

The resource pad uses a Clip approach, and the Gate makes use of a Wire approach. This bonding technique is slightly cheaper than the all-copper bonding method, saving wafer location (appropriate to extremely small gateway locations). The procedure is easier than the all-copper bonding technique and can get much better Rdson and much better thermal impact.

Supplier of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding molten copper, please feel free to contact us and send an inquiry.

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